IEEE Electron Device Letters · 2021 · 21 citations · 26 references
EngineeringElectrical EngineeringMaterials ScienceElectrochemistryElectronic MaterialsSemiconductor DevicesComplementary Metal-oxide-semiconductor TechnologyLeakage Power ReductionMetal-oxide-semiconductor Field-effect TransistorsEquivalent Oxide ThicknessGate LeakageGate Leakage CurrentGate Oxide LeakageGate OxidesLeakage Current ReductionOxidation StatesOxygen Vacancy Formation
Significant improvements on Ge nMOSFET can be achieved by a novel low temperature supercritical phase fluid treatment with H <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> cosolvent. Thanks to the reduction of oxygen vacancy and unstable oxidation states, devices with the proposed treatment exhibit a low equivalent oxide thickness of 0.67 nm, 2-order reduction on gate leakage current, 7 times improvement on on-current, very low subthreshold swing of 79 mV/dev, high on/off current ratio, small hysteresis of 43.3 mV, low interface trap density, excellent uniformity and reliability characteristics.
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