Facile approach to mitigate thermal issues in 3D IC integration using effective FIN orientation

3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration

Kaustav Banerjee, S.J. Souri, Pawan Kapur et al. · Proceedings of the IEEE · 2001 · 1K citations

Engineering, Computer Engineering, Electrical Engineering +17

Three-Dimensional Integrated Circuits and the Future of System-on-Chip Designs

Robert Patti · Proceedings of the IEEE · 2006 · 595 citations

Engineering, Computer Engineering, Electrical Engineering +14

8 Gb 3-D DDR3 DRAM Using Through-Silicon-Via Technology

Uksong Kang, Hoeju Chung, Seongmoo Heo et al. · IEEE Journal of Solid-State Circuits · 2010 · 487 citations

Engineering, Computer Engineering, Electrical Engineering +15

Planar carbon nanotube–graphene hybrid films for high-performance broadband photodetectors

Yuanda Liu, Fengqiu Wang, Xiaomu Wang et al. · Nature Communications · 2015 · 305 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Bridging the Processor-Memory Performance Gapwith 3D IC Technology

C.C. Liu, Ilya Ganusov, Martin Burtscher et al. · IEEE Design & Test of Computers · 2005 · 282 citations

Engineering, Computer Engineering, Computer Science +17