Concepedia

Marri Sai Venkat Goud

MS

1

Publications

14

Citations

1

H-Index

2020

Active since

Marri Sai Venkat Goud is an author specializing in electronic packaging, engineering, and 3d integration.

Top concepts

EngineeringHeat Transfer3D IntegrationMicroelectronicsThermal EngineeringComputer EngineeringElectronic Packaging

Publications per year

2020–2020

1

Publications

1

Facile approach to mitigate thermal issues in 3D IC integration using effective FIN orientation

Banothu Rakesh, Kailaas Mahindra, Marri Sai Venkat Goud et al. · Materials Today Proceedings · 2020 · 14 citations

3D Ic Architecture, Physical Design (Electronics), Engineering +11

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