Hoeju Chung

8 Gb 3-D DDR3 DRAM Using Through-Silicon-Via Technology

Uksong Kang, Hoeju Chung, Seongmoo Heo et al. · IEEE Journal of Solid-State Circuits · 2010 · 487 citations

Engineering, Computer Engineering, Electrical Engineering +15

A 20nm 1.8V 8Gb PRAM with 40MB/s program bandwidth

Youngdon Choi, Ickhyun Song, Mu-Hui Park et al. · 2012 · 309 citations

Engineering, Computer Engineering, Computer Science +16

A 58nm 1.8V 1Gb PRAM with 6.4MB/s program BW

Hoeju Chung, Byung‐Hoon Jeong, Byung-Jun Min et al. · 2011 · 83 citations

Engineering, Computer Engineering, Electrical Engineering +14

8Gb 3D DDR3 DRAM using through-silicon-via technology

Uksong Kang, Hoeju Chung, Seongmoo Heo et al. · 2009 · 73 citations

Engineering, Computer Engineering, Electrical Engineering +17

A 3.2 Gbps/pin 8 Gbit 1.0 V LPDDR4 SDRAM With Integrated ECC Engine for Sub-1 V DRAM Core Operation

Tae-Young Oh, Hoeju Chung, Junyoung Park et al. · IEEE Journal of Solid-State Circuits · 2014 · 50 citations

Engineering, Computer Engineering, Electrical Engineering +17