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Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process

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Review of silver nanoparticle based die attach materials for high power/temperature applications

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Natural Sciences, Materials Engineering, Materials Science +11

Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles

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Natural Sciences, Materials Engineering, Materials Science +16

Trapping phenomena and degradation mechanisms in GaN-based power HEMTs

Matteo Meneghini, Alaleh Tajalli, P. Moens et al. · Materials Science in Semiconductor Processing · 2017 · 111 citations · Full text

Engineering, Electrical Engineering, Materials Science +17