Miniaturized and high-performance RF packages with ultra-thin glass substrates

Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs

Vijay Sukumaran, Tapobrata Bandyopadhyay, Venky Sundaram et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 273 citations

Engineering, Electrical Engineering, Materials Science +17

Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon

Vijay Sukumaran, Gokul Kumar, Koushik Ramachandran et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 138 citations

Engineering, Electrical Engineering, Materials Science +17

Gigabit Wireless: System-on-a-Package Technology

Rao Tummala, J. Laskar · Proceedings of the IEEE · 2004 · 81 citations

Engineering, Electrical Engineering, Antennas +16