Concepedia

Radio-frequency Packaging

Radio-Frequency Packaging is a microwave semiconductor device integration methodology that encapsulates and interconnects active devices while preserving high-frequency performance through minimized parasitic effects and electromagnetic compatibility.

718

Publications

23.8K

Citations

2.6K

Authors

443

Institutions

Publications per year

2017–2026

129

Parents

Publications

718

On-chip spiral inductors with patterned ground shields for Si-based RF ICs

C. Patrick Yue, S.S. Wong · IEEE Journal of Solid-State Circuits · 1998 · 1.1K citations

, , +16

On-chip Spiral Inductors With Patterned Ground Shields For Si-based RF IC's

Yue Yue, Wong · 1997 · 438 citations

, , +15

Low-profile enhanced-bandwidth PIFA antennas for wireless communications packaging

K.L. Virga, Yahya Rahmat‐Samii · IEEE Transactions on Microwave Theory and Techniques · 1997 · 256 citations

, , +16

An Overview of the Development of Antenna-in-Package Technology for Highly Integrated Wireless Devices

Yueping Zhang, Junfa Mao · Proceedings of the IEEE · 2019 · 226 citations

, , +16

Antenna-in-Package Design Considerations for Ka-Band 5G Communication Applications

Duixian Liu, Xiaoxiong Gu, Christian Baks et al. · IEEE Transactions on Antennas and Propagation · 2017 · 224 citations

, , +16

1–5 of 718

Authors

2.6K

  1. MM
    Manos M. Tentzeris

    Georgia Institute of Technology, United States

    23 publications · 1.1K citations

    18

    h-index

  2. JL
    J. Laskar

    Georgia Institute of Technology, United States

    32 publications · 1.1K citations

    17

    h-index

  3. RT
    Rao Tummala

    Georgia Institute of Technology, United States

    19 publications · 714 citations

    15

    h-index

  4. MS
    Madhavan Swaminathan

    Georgia Institute of Technology, United States

    19 publications · 489 citations

    14

    h-index

  5. TZ
    Thomas Zwick

    Karlsruhe Institute of Technology, Germany

    13 publications · 438 citations

    13

    h-index

1–5 of 2.6K

Institutions

443

  1. Georgia Institute of Technology

    Atlanta, United States

    28 h-index

    390 publications

    12.8K citations

  2. IBM Research - Thomas J. Watson Research Center

    Yorktown Heights, United States

    16 h-index

    91 publications

    6.2K citations

  3. Infineon Technologies (Germany)

    Munich, Germany

    15 h-index

    82 publications

    3K citations

  4. Nanyang Technological University

    Singapore, Singapore

    15 h-index

    28 publications

    1.7K citations

  5. STMicroelectronics (France)

    Montrouge, France

    15 h-index

    69 publications

    1.6K citations

  6. IMEC

    Leuven, Belgium

    14 h-index

    105 publications

    3.2K citations

  7. Chalmers University of Technology

    Gothenburg, Sweden

    14 h-index

    67 publications

    2.9K citations

  8. IBM (United States)

    Armonk, United States

    13 h-index

    54 publications

    3.6K citations

1–8 of 443

Venues

  1. 33

    h-index

  2. IEEE Transactions on Advanced Packaging

    35 publications · 1.4K citations

    19

    h-index

  3. 18

    h-index

  4. IEEE Microwave and Wireless Components Letters

    24 publications · 991 citations

    17

    h-index

  5. IEEE Transactions on Antennas and Propagation

    16 publications · 981 citations

    14

    h-index

1–5