Gapyeol Park

Deep Reinforcement Learning-Based Optimal Decoupling Capacitor Design Method for Silicon Interposer-Based 2.5-D/3-D ICs

Hyunwook Park, Junyong Park, Subin Kim et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2020 · 78 citations

3D Ic Architecture, Electrical Engineering, Engineering +13

Signal Integrity Design and Analysis of Differential High-Speed Serial Links in Silicon Interposer With Through-Silicon Via

Kyungjun Cho, Youngwoo Kim, Hyunsuk Lee et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 36 citations

Engineering, Vlsi Design, Computer Architecture +16

Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme

Seongguk Kim, Subin Kim, Kyungjun Cho et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2021 · 32 citations

Engineering, Vlsi Design, Computer Architecture +17

Reinforcement Learning-Based Optimal on-Board Decoupling Capacitor Design Method

Hyunwook Park, Junyong Park, Subin Kim et al. · 2018 · 28 citations

Electrical Engineering, Engineering, Dynamic Optimization +11

Wideband Power/Ground Noise Suppression in Low-Loss Glass Interposers Using a Double-Sided Electromagnetic Bandgap Structure

Youngwoo Kim, Gapyeol Park, Kyungjun Cho et al. · IEEE Transactions on Microwave Theory and Techniques · 2020 · 24 citations

Photonics, Electrical Engineering, Engineering +15