Concepedia

Glass-based Packaging

Glass-Based Packaging is a hermetic encapsulation technique within MEMS packaging that utilizes glass materials as the primary sealing medium to provide electrical insulation, chemical inertness, and thermal stability, distinguished by its use of direct bonding or glass frit materials for chip-level enclosure.

86

Publications

2.8K

Citations

343

Authors

106

Institutions

Publications per year

2017–2026

34

Parents

Publications

86

Glass frit bonding: an universal technology for wafer level encapsulation and packaging

Roy Knechtel · Microsystem Technologies · 2005 · 188 citations

, , +16

Self-cleaning and antireflective packaging glass for solar modules

Lalit Verma, Mridul Sakhuja, J. Son et al. · Renewable Energy · 2011 · 186 citations

, , +12

A hermetic glass-silicon micropackage with high-density on-chip feedthroughs for sensors and actuators

Babak Ziaie, Jeffrey A. Von Arx, Mehmet R. Dokmeci et al. · Journal of Microelectromechanical Systems · 1996 · 126 citations

, , +17

Ultrathin Antenna-Integrated Glass-Based Millimeter-Wave Package With Through-Glass Vias

Atom O. Watanabe, Tong‐Hong Lin, Muhammad Ali et al. · IEEE Transactions on Microwave Theory and Techniques · 2020 · 86 citations

, , +17

Glass-to-glass encapsulation with ultraviolet light curable epoxy edge sealing for stable perovskite solar cells

Easwaramoorthi Ramasamy, Vaithinathan Karthikeyan, Kadusu Rameshkumar et al. · Materials Letters · 2019 · 82 citations

, , +15

1–5 of 86

Authors

343

  1. RT
    Rao Tummala

    Georgia Institute of Technology, United States

    14 publications · 458 citations

    14

    h-index

  2. VS
    Venky Sundaram

    Georgia Institute of Technology, United States

    10 publications · 283 citations

    10

    h-index

  3. VS
    Vanessa Smet

    Georgia Institute of Technology, United States

    8 publications · 266 citations

    8

    h-index

  4. MS
    Madhavan Swaminathan

    Georgia Institute of Technology, United States

    6 publications · 255 citations

    6

    h-index

  5. MJ
    Michael J. Topper

    Fraunhofer Institute for Reliability and Microintegration, Germany

    4 publications · 88 citations

    4

    h-index

1–5 of 343

Institutions

106

  1. Georgia Institute of Technology

    Atlanta, United States

    16 h-index

    95 publications

    3.4K citations

  2. Fraunhofer Institute for Reliability and Microintegration

    Berlin, Germany

    6 h-index

    28 publications

    645 citations

  3. Asahi Glass (Japan)

    Tokyo, Japan

    6 h-index

    11 publications

    235 citations

  4. Qualcomm (United States)

    San Diego, United States

    4 h-index

    9 publications

    183 citations

  5. Corning (United States)

    Corning, United States

    4 h-index

    8 publications

    312 citations

  6. University of Michigan

    Ann Arbor, United States

    3 h-index

    10 publications

    630 citations

  7. Universidade do Porto

    Porto, Portugal

    3 h-index

    16 publications

    448 citations

  8. Inha University

    Incheon, South Korea

    2 h-index

    7 publications

    195 citations

1–8 of 106

Venues

  1. 8

    h-index

  2. Journal of Micromechanics and Microengineering

    JMM · 3 publications · 72 citations

    3

    h-index

  3. Microsystem Technologies

    3 publications · 239 citations

    3

    h-index

  4. Journal of the American Ceramic Society

    2 publications · 92 citations

    2

    h-index

  5. Sensors and Actuators A Physical

    2 publications · 25 citations

    2

    h-index

1–5