Effects of twin grain boundaries on the subgrain rotation of the solder joint during thermal shock

A review: On the development of low melting temperature Pb-free solders

Hiren R. Kotadia, Philip D. Howes, S.H. Mannan · Microelectronics Reliability · 2014 · 465 citations

Natural Sciences, Materials Engineering, Materials Science +11

Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints

Thomas R. Bieler, Hairong Jiang, L.P. Lehman et al. · IEEE Transactions on Components and Packaging Technologies · 2008 · 260 citations

Engineering, Materials Engineering, Materials Science +17

Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders

Minhua Lu, Da‐Yuan Shih, Paul Lauro et al. · Applied Physics Letters · 2008 · 246 citations

Natural Sciences, Electrical Engineering, Materials Science +16

Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys

Adwait U. Telang, Thomas R. Bieler, J. P. Lucas et al. · Journal of Electronic Materials · 2004 · 134 citations

Natural Sciences, Materials Engineering, Materials Science +17

The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints

Thomas R. Bieler, Bite Zhou, Lauren Blair et al. · Journal of Electronic Materials · 2011 · 129 citations

Natural Sciences, Materials Engineering, Materials Science +17