Bite Zhou

The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints

Thomas R. Bieler, Bite Zhou, Lauren Blair et al. · Journal of Electronic Materials · 2011 · 129 citations

Natural Sciences, Materials Engineering, Materials Science +17

Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy

Tae-Kyu Lee, Bite Zhou, Lauren Blair et al. · Journal of Electronic Materials · 2010 · 82 citations

Natural Sciences, Materials Engineering, Materials Science +12

Crack Development in a Low-Stress PBGA Package due to Continuous Recrystallization Leading to Formation of Orientations with [001] Parallel to the Interface

Bite Zhou, Thomas R. Bieler, Tae-Kyu Lee et al. · Journal of Electronic Materials · 2010 · 70 citations

Natural Sciences, Materials Engineering, Materials Science +14

Methodology for Analyzing Slip Behavior in Ball Grid Array Lead-Free Solder Joints After Simple Shear

Bite Zhou, Thomas R. Bieler, Tae-Kyu Lee et al. · Journal of Electronic Materials · 2009 · 61 citations

Engineering, Materials Engineering, Materials Science +12

Slip, Crystal Orientation, and Damage Evolution During Thermal Cycling in High-Strain Wafer-Level Chip-Scale Packages

Bite Zhou, Quan Zhou, Thomas R. Bieler et al. · Journal of Electronic Materials · 2015 · 46 citations

Natural Sciences, Materials Engineering, Materials Science +17