Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy

Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints

Thomas R. Bieler, Hairong Jiang, L.P. Lehman et al. · IEEE Transactions on Components and Packaging Technologies · 2008 · 257 citations

Friction Welding, Engineering, Severe Plastic Deformation +16

Effect of thermo-mechanically induced microstructural coarsening on the evolution of creep response of SnAg-based microelectronic solders

I. Dutta, Dongdong Pan, Robert A. Marks et al. · Materials Science and Engineering A · 2005 · 152 citations

Materials Science, Engineering, Severe Plastic Deformation +14

Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys

Adwait U. Telang, Thomas R. Bieler, J. P. Lucas et al. · Journal of Electronic Materials · 2004 · 134 citations

Materials Science, Materials Engineering, Engineering +10

Incremental recrystallization/grain growth driven by elastic strain energy release in a thermomechanically fatigued lead-free solder joint

Adwait U. Telang, Thomas R. Bieler, A. Zamiri et al. · Acta Materialia · 2007 · 117 citations

Materials Science, Engineering, Severe Plastic Deformation +10

Thermomechanical fatigue damage evolution in SAC solder joints

M. A. Matin, W.P. Vellinga, M.G.D. Geers · Materials Science and Engineering A · 2006 · 108 citations

Materials Science, Engineering, Mechanical Engineering +6