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Effect of thermo-mechanically induced microstructural coarsening on the evolution of creep response of SnAg-based microelectronic solders

Materials ScienceEngineeringSevere Plastic DeformationMicrofabricationMechanical EngineeringApplied PhysicsSnag-based Microelectronic SoldersHot WorkingMicrostructure-strength RelationshipInduced Microstructural CoarseningCreep ResponsePlasticityElectronic PackagingThermomechanical AnalysisThermomechanical ProcessingMechanics Of MaterialsMicrostructure