S. G. Jadhav

Effect of thermo-mechanically induced microstructural coarsening on the evolution of creep response of SnAg-based microelectronic solders

I. Dutta, Dongdong Pan, Robert A. Marks et al. · Materials Science and Engineering A · 2005 · 152 citations

Materials Science, Engineering, Severe Plastic Deformation +14

1.6 Tbps Silicon Photonics Integrated Circuit and 800 Gbps Photonic Engine for Switch Co-Packaging Demonstration

Saeed Fathololoumi, David Hui, S. G. Jadhav et al. · Journal of Lightwave Technology · 2020 · 143 citations

Siph Ics, Engineering, Device Integration +22

Co-Packaged Photonics For High Performance Computing: Status, Challenges And Opportunities

Ravi Mahajan, Xiaoqian Li, Joshua B. Fryman et al. · Journal of Lightwave Technology · 2021 · 133 citations

Engineering, Device Integration, Integrated Photonics +17

Stress relaxation behavior of composite and eutectic Sn-Ag solder joints

S. G. Jadhav, Thomas R. Bieler, K. N. Subramanian et al. · Journal of Electronic Materials · 2001 · 52 citations

Materials Science, Friction Welding, Engineering +3

A comparison of impression and compression creep behavior of polycrystalline Sn

C. Park, Xin Long, Sol Haberman et al. · Journal of Materials Science · 2007 · 34 citations

Materials Science, Engineering, Severe Plastic Deformation +12