S. G. Jadhav - Concepedia

Author

S. G. Jadhav

Intel (United States)ORCID

Also Known As

S. G. Jadhav, S. Jadhav, S.G. Jadhav, Shrutika Jadhav, Susheel Jadhav

Publications

618

Citations

H-Index

Concepts

All Affiliations

Intel (United States)Naval Postgraduate School

About

S. G. Jadhav is an author at Intel (United States) specializing in engineering, electronic packaging, and mechanical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	9	9	593
2	Materials Science	6	6	307
3	Applied Physics	4	4	334
4	Electrical Engineering	3	3	286
5	Computer Engineering	2	2	276

S. G. Jadhav

Publications

604

Citations

H-Index

Page 1

	Year	Citations
Effect of thermo-mechanically induced microstructural coarsening on the evolution of creep response of SnAg-based microelectronic solders I. Dutta, Dongdong Pan, Robert A. Marks, Materials Science and Engineering A Materials ScienceEngineeringSevere Plastic DeformationMicrofabricationMechanical Engineering	2005	152
1.6 Tbps Silicon Photonics Integrated Circuit and 800 Gbps Photonic Engine for Switch Co-Packaging Demonstration Saeed Fathololoumi, David Hui, S. G. Jadhav, Journal of Lightwave Technology Siph IcsEngineeringDevice IntegrationIntegrated PhotonicsIntegrated Circuits	2020	143
Co-Packaged Photonics For High Performance Computing: Status, Challenges And Opportunities Ravi Mahajan, Xiaoqian Li, Joshua B. Fryman, Journal of Lightwave Technology EngineeringDevice IntegrationIntegrated PhotonicsComputer ArchitecturePhotonics Modules	2021	133
Stress relaxation behavior of composite and eutectic Sn-Ag solder joints S. G. Jadhav, Thomas R. Bieler, K. N. Subramanian, Journal of Electronic Materials Materials ScienceFriction WeldingEngineeringElectronic PackagingStress Relaxation Behavior	2001	52
A comparison of impression and compression creep behavior of polycrystalline Sn C. Park, Xin Long, Sol Haberman, Journal of Materials Science Materials ScienceEngineeringSevere Plastic DeformationMechanical PropertiesMechanical Behavior	2007	34
Miniaturized impression creep testing of ball grid array solder balls attached to microelectronic packaging substrates Dongdong Pan, Robert A. Marks, I. Dutta, Review of Scientific Instruments EngineeringMechanical EngineeringPackaging SubstratesCreep BehaviorAdvanced Packaging (Semiconductors)	2004	27
Impression creep testing and microstructurally adaptive creep modeling of lead free solder interconnects I. Dutta, Dongdong Pan, S. G. Jadhav EngineeringSevere Plastic DeformationMechanical EngineeringMechanics Of MaterialsMicrostructure-strength Relationship	2005	27
Impression creep characterization of 90Pb-10Sn microelectronic solder balls at subsolvus and supersolvus temperatures Dongdong Pan, I. Dutta, S. G. Jadhav, Journal of Electronic Materials Materials ScienceMaterial AnalysisEngineeringSuperalloySevere Plastic Deformation	2005	15
Novel Process Techniques to Reduce Voids in Solder Thermal Interface Materials Used for Flip-Chip Package Applications Marcelo Montaño, J. Garay Garcia, Weimin Shi,	2005	11
Tombstone Initiation Model for Small Form-Factor Surface Mount Passives Nachiket Raravikar, Rahul Panat, S. G. Jadhav IEEE Transactions on Components Packaging and Manufacturing Technology Initiation ModelEngineeringMechanical EngineeringComputational MechanicsPhysical Design (Electronics)	2012	10

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