Stress relaxation behavior of composite and eutectic Sn-Ag solder joints

References

Page 1

	Year	Citations
Lead-free Solders in Microelectronics Mulugeta Abtew, Guna S Selvaduray Materials Science and Engineering R Reports Electrical EngineeringMiniaturizationEngineeringAdvanced Packaging (Semiconductors)Nanoelectronics	2000	1.9K
Problems of plastic gliding E. Orowan Proceedings of the Physical Society Materials ScienceMetal Single CrystalsHydroelasticityEngineeringDislocation Interaction	1940	663
Metallurgy of low temperature Pb-free solders for electronic assembly J. Glazer International Materials Reviews EngineeringPb-free SoldersMechanical EngineeringCorrosionElectronic Packaging	1995	415
Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders H. Mavoori, Jason Chin, Semyon Vaynman, Journal of Electronic Materials Materials ScienceMaterials EngineeringPlastic DeformationEngineeringSevere Plastic Deformation	1997	234
Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging S. Choi, Thomas R. Bieler, J. P. Lucas, Journal of Electronic Materials Materials ScienceMaterials EngineeringSn-pb Eutectic SoldersEngineeringCorrosion	1999	215
Interpretation of high temperature plastic deformation in terms of measured effective stresses A.A. Solomon, William D. Nix Acta Metallurgica Materials ScienceEngineeringSevere Plastic DeformationMechanical EngineeringWork Hardening	1970	101
On the anelastic contribution to creep G.J. Lloyd, RJ McElroy Acta Metallurgica Anelastic ContributionEngineeringStrain LocalizationMechanicsMechanical Engineering	1974	96
Creep properties of Sn-Ag solder joints containing intermetallic particles S. Choi, Jin Gyun Lee, Fei Guo, JOM Materials ScienceFriction WeldingEngineeringMetallurgical InteractionCreep Properties	2001	66
Deformation Modeling Applied to Stress Relaxation of Four Solder Alloys R. W. Rohde, J.C. Swearengen Journal of Engineering Materials and Technology Materials ScienceEngineeringSevere Plastic DeformationDislocation GlideSolder Alloys	1980	46
Stress relaxation in Tin-Lead solders Eric Baker Materials Science and Engineering Materials EngineeringMaterials ScienceEngineeringCorrosionMetallurgical Process	1979	35

Page 1