Kuo-Chuan Liu

The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints

Thomas R. Bieler, Bite Zhou, Lauren Blair et al. · Journal of Electronic Materials · 2011 · 129 citations

Natural Sciences, Materials Engineering, Materials Science +17

Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy

Tae-Kyu Lee, Bite Zhou, Lauren Blair et al. · Journal of Electronic Materials · 2010 · 82 citations

Natural Sciences, Materials Engineering, Materials Science +12

Crack Development in a Low-Stress PBGA Package due to Continuous Recrystallization Leading to Formation of Orientations with [001] Parallel to the Interface

Bite Zhou, Thomas R. Bieler, Tae-Kyu Lee et al. · Journal of Electronic Materials · 2010 · 70 citations

Natural Sciences, Materials Engineering, Materials Science +14

Impact of Microstructure Evolution and Isothermal Aging on Sn-Ag-Cu Solder Interconnect Board-Level High-G Mechanical Shock Performance and Crack Propagation

Tae-Kyu Lee, Bite Zhou, Thomas R. Bieler et al. · Journal of Electronic Materials · 2011 · 24 citations

Engineering, Materials Engineering, Materials Science +16

Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects

Tae-Kyu Lee, Bo Liu, Bite Zhou et al. · Journal of Electronic Materials · 2011 · 22 citations

Natural Sciences, Materials Engineering, Materials Science +14