Tae-Kyu Lee

Methodology for Analyzing Slip Behavior in Ball Grid Array Lead-Free Solder Joints After Simple Shear

Bite Zhou, Thomas R. Bieler, Tae-Kyu Lee et al. · Journal of Electronic Materials · 2009 · 61 citations

Engineering, Materials Engineering, Materials Science +12

Microstructure and Orientation Evolution of the Sn Phase as a Function of Position in Ball Grid Arrays in Sn-Ag-Cu Solder Joints

Tae-Kyu Lee, Kuo-Chuan Liu, Thomas R. Bieler · Journal of Electronic Materials · 2009 · 43 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance

Tae-Kyu Lee, Bite Zhou, Thomas R. Bieler et al. · Journal of Electronic Materials · 2012 · 18 citations

Natural Sciences, Materials Engineering, Materials Science +7

Methodology for Analyzing Strain States During In Situ Thermomechanical Cycling in Individual Lead-Free Solder Joints Using Synchrotron Radiation

Thomas R. Bieler, Tae-Kyu Lee, Kuo-Chuan Liu · Journal of Electronic Materials · 2009 · 16 citations

Engineering, Materials Engineering, Materials Science +14