Methodology for Analyzing Strain States During In Situ Thermomechanical Cycling in Individual Lead-Free Solder Joints Using Synchrotron Radiation

Crystallite size distribution and dislocation structure determined by diffraction profile analysis: principles and practical application to cubic and hexagonal crystals

T. Ungár, Jenő Gubicza, Gábor Ribárik et al. · Journal of Applied Crystallography · 2001 · 773 citations

Natural Sciences, Materials Engineering, Materials Science +17

Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints

Thomas R. Bieler, Hairong Jiang, L.P. Lehman et al. · IEEE Transactions on Components and Packaging Technologies · 2008 · 260 citations

Engineering, Materials Engineering, Materials Science +17

Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder

L.P. Lehman, S. N. Athavale, Travis Z. Fullem et al. · Journal of Electronic Materials · 2004 · 171 citations

Natural Sciences, Materials Engineering, Materials Science +14

Effect of thermo-mechanically induced microstructural coarsening on the evolution of creep response of SnAg-based microelectronic solders

I. Dutta, Dongdong Pan, Robert A. Marks et al. · Materials Science and Engineering A · 2005 · 153 citations

Natural Sciences, Materials Engineering, Materials Science +16

Incremental recrystallization/grain growth driven by elastic strain energy release in a thermomechanically fatigued lead-free solder joint

Adwait U. Telang, Thomas R. Bieler, A. Zamiri et al. · Acta Materialia · 2007 · 119 citations

Natural Sciences, Materials Engineering, Materials Science +16