The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance

Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys

Kil-Won Moon, W. J. Boettinger, Ursula R. Kattner et al. · Journal of Electronic Materials · 2000 · 557 citations

Natural Sciences, Materials Engineering, Materials Science +14

Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening

H. K. Kim, K. N. Tu · Physical review. B, Condensed matter · 1996 · 501 citations

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Influence of grain size and stacking-fault energy on deformation twinning in fcc metals

Ehab A. El‐Danaf, Surya R. Kalidindi, R.D. Doherty · Metallurgical and Materials Transactions A · 1999 · 497 citations

Natural Sciences, Materials Engineering, Materials Science +17

Metallurgy of low temperature Pb-free solders for electronic assembly

J. Glazer · International Materials Reviews · 1995 · 416 citations

Natural Sciences, Materials Engineering, Materials Science +13

Effect of silver content on thermal fatigue life of Sn-xAg-0.5Cu flip-chip interconnects

Shin‐Ichi Terashima, Yoshiharu Kariya, Takuya Hosoi et al. · Journal of Electronic Materials · 2003 · 175 citations

Engineering, Materials Engineering, Materials Science +16