IEEE Transactions on Electron Devices · 2006 · 60 citations · 6 references
EngineeringElectrical EngineeringMaterials ScienceElectronic MaterialsPower ElectronicsSemiconductor DevicesLeakage Power ReductionSemiconductor Device MaterialsSemiconductor ReliabilityWide Band Gap SemiconductorsWide-bandgap Semiconductor DevicesWide-bandgap SemiconductorsCurrent DensityImplantation WindowJunction Leakage CurrentLeakageLeakage CurrentLeakage Current ReductionSchottky Barrier CharacteristicsSchottky Barrier Diodes
The 1-kV 4H-SiC planar junction barrier Schottky (JBS) rectifiers were designed, fabricated, and characterized. Different p+ implantation dosages and activation anneal methods were used to determine an optimum baseline process. Using the optimized process, the forward drop of our JBS rectifiers is <1.5 V while the reverse leakage current density is <1/spl times/10/sup -5/ A/cm/sup -2/. Blocking voltage>1 kV was achieved using a single-zone junction termination extension termination. It was shown experimentally that 4-/spl mu/m p-type implantation window spacing gives an optimum tradeoff between forward drop voltage and leakage current density for these rectifiers, yielding a specific on-resistance of 3 m/spl Omega//spl middot/cm/sup 2/.
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A 2.8kV, Forward Drop JBS Diode with Low Leakage
Fanny Dahlquist, Jan-Olov Svedberg, Carl‐Mikael Zetterling et al. · Materials science forum · 2000 · 36 citations · Full text
1500 V, 4 amp 4H-SiC JBS diodes
Ranbir Singh, Sei‐Hyung Ryu, John W. Palmour et al. · 2002 · 26 citations
Annealing ion implanted SiC with an AlN cap
Keith Jones, Pankaj B. Shah, K. W. Kirchner et al. · Materials Science and Engineering B · 1999 · 24 citations
Natural Sciences, Materials Engineering, Materials Science +9