Effects of direct current and pulse-reverse copper plating waveforms on the incubation behavior of self-annealing - Concepedia

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Effects of direct current and pulse-reverse copper plating waveforms on the incubation behavior of self-annealing

25

Citations

16

References

2010

Year

Min‐Yuan Cheng, Kei-Wei Chen, Tzeng‐Feng Liu, Ying-Lang Wang, Hsien‐Ping Feng

Thin Solid Films

Materials ScienceMaterials EngineeringElectrical EngineeringEngineeringMicrofabricationApplied PhysicsIncubation BehaviorMicroelectronics

References

	Year	Citations

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