Effects of direct current and pulse-reverse copper plating waveforms on the incubation behavior of self-annealing

Stresses and deformation processes in thin films on substrates

M. Doerner, William D. Nix · Critical reviews in solid state and materials sciences/CRC critical reviews in solid state and materials sciences · 1988 · 604 citations

Natural Sciences, Materials Engineering, Materials Science +17

Mechanisms for microstructure evolution in electroplated copper thin films near room temperature

J. M. E. Harper, C. Cabral, P. C. Andricacos et al. · Journal of Applied Physics · 1999 · 359 citations

Natural Sciences, Materials Engineering, Materials Science +17

Liner materials for direct electrodeposition of Cu

Michael Lane, Conal E. Murray, F. R. McFeely et al. · Applied Physics Letters · 2003 · 162 citations

Natural Sciences, Materials Engineering, Materials Science +15

Effects of barrier layer and annealing on abnormal grain growth in copper thin films

E. M. Zielinski, Richard P. Vinci, J. C. Bravman · Journal of Applied Physics · 1994 · 132 citations

Natural Sciences, Materials Engineering, Materials Science +17

Correlation of stress and texture evolution during self- and thermal annealing of electroplated Cu films

Haebum Lee, S.S. Wong, S.D. Lopatin · Journal of Applied Physics · 2003 · 130 citations

Natural Sciences, Materials Engineering, Materials Science +17