Concepedia

Haebum Lee

HL

Statistics

Publications

4

Citations

377

H-Index

4

Active since

1998

Affiliations

Advanced Micro Devices (United States)(Current)

Stanford University

Haebum Lee is an author at Advanced Micro Devices (United States) specializing in engineering, electronic packaging, and electrical engineering.

Top concepts

EngineeringElectronic PackagingMicrostructureMaterial ScienceMaterials EngineeringElectrical EngineeringApplied PhysicsElectrical InsulationMechanical EngineeringCorrosion

Publications per year

1998–2005

4

Publications

4

Microstructure and reliability of copper interconnects

Changsup Ryu, Kee-Won Kwon, Alvin L. S. Loke et al. · IEEE Transactions on Electron Devices · 1999 · 185 citations

Engineering, Cvd Cu, Chemical Deposition +17

Correlation of stress and texture evolution during self- and thermal annealing of electroplated Cu films

Haebum Lee, S.S. Wong, S.D. Lopatin · Journal of Applied Physics · 2003 · 128 citations

Cu Films, Engineering, Severe Plastic Deformation +18

The influence of barrier types on the microstructure and electromigration characteristics of electroplated copper

Haebum Lee, S.D. Lopatin · Thin Solid Films · 2005 · 42 citations

Materials Science, Materials Engineering, Electrical Engineering +12

Barriers For Copper Interconnections

S.S. Wong, Changsup Ryu, Haebum Lee et al. · MRS Proceedings · 1998 · 22 citations

Electrical Engineering, Electromigration Technique, Copper Interconnections +4

1–4 of 4