Hsien‐Ping Feng - Concepedia

Author

Hsien‐Ping Feng

National Tsing Hua University

Also Known As

H.P. Feng, Hsien-Ping Feng, Hsien‐Ping Feng

Publications

249

Citations

H-Index

Concepts

All Affiliations

National Tsing Hua University National Yang Ming Chiao Tung University National University of Tainan Massachusetts Institute of Technology Boston College

About

Hsien‐Ping Feng is an author at National Tsing Hua University specializing in engineering, electrical engineering, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	5	5	160
2	Electrical Engineering	4	4	131
3	Applied Physics	2	2	44
4	Chemical Engineering	2	2	53
5	Chemistry	1	1	63

Hsien‐Ping Feng

Publications

225

Citations

H-Index

Page 1

	Year	Citations
The simple and easy way to manufacture counter electrode for dye-sensitized solar cells Jo‐Lin Lan, Yung-Yun Wang, Chi‐Chao Wan, Current Applied Physics Electrical EngineeringEngineeringOrganic Solar CellDye-sensitized Solar CellsCounter Electrode	2009	63
Effect of plating current density and annealing on impurities in electroplated Cu film Chi-Wen Liu, Ying-Lang Wang, Ming-Shih Tsai, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films	2005	29
Studies on surface preparation and smoothness of nanostructured Bi2Te3-based alloys by electrochemical and mechanical methods Hsien‐Ping Feng, Bo Yu, Shuo Chen, Electrochimica Acta Materials ScienceChemical EngineeringSurface PreparationEngineeringElectrode-electrolyte Interface	2010	29
Effects of direct current and pulse-reverse copper plating waveforms on the incubation behavior of self-annealing Min‐Yuan Cheng, Kei-Wei Chen, Tzeng‐Feng Liu, Thin Solid Films Materials ScienceMaterials EngineeringElectrical EngineeringEngineeringMicrofabrication	2010	25
Nanoparticle‐Enabled Selective Electrodeposition Hsien‐Ping Feng, Trilochan Paudel, Bo Yu, Advanced Materials Materials ScienceChemical EngineeringElectrical EngineeringEngineeringPlatinum Nanoparticles	2011	24
Behavior of Copper Removal by CMP and Its Correlation to Deposit Structure and Impurity Content Hsien‐Ping Feng, Jeng‐Yu Lin, Ming-Yung Cheng, Journal of The Electrochemical Society	2007	24
Mechanism for Cu void defect on various electroplated film conditions Hsien‐Ping Feng, Min‐Yuan Cheng, Y.L. Wang Thin Solid Films Materials ScienceMaterials EngineeringElectrical EngineeringElectromigration TechniqueEngineering	2005	19
Void Defect Reduction after Chemical Mechanical Planarization of Trenches Filled by Direct/Pulse Plating Jeng‐Yu Lin, Chi‐Chao Wan, Yung-Yun Wang, Journal of The Electrochemical Society	2007	12

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