Ming-Shih Tsai

Room temperature negative differential resistance in DNA-based molecular devices

Peng-Chung Jangjian, Tzeng-Feng Liu, Mei-Yi Li et al. · Applied Physics Letters · 2009 · 39 citations

Engineering, Bioengineering, Molecular Biology +17

Effect of plating current density and annealing on impurities in electroplated Cu film

Chi-Wen Liu, Ying-Lang Wang, Ming-Shih Tsai et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2005 · 30 citations

Natural Sciences, Materials Engineering, Materials Science +13

Effects of wetting ability of plating electrolyte on Cu seed layer for electroplated copper film

Chi-Wen Liu, Jung-Chih Tsao, Ming-Shih Tsai et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2004 · 23 citations

Natural Sciences, Materials Engineering, Materials Science +17

Ni²⁺doping DNA: a semiconducting biopolymer

Peng-Chung Jang Jian, Tzeng-Feng Liu, Chuan-Mei Tsai et al. · Nanotechnology · 2008 · 16 citations

Natural Sciences, Chemistry, Materials Science +15

Selective Copper Metallization by Electrochemical Contact Displacement with Amorphous Silicon Film

Yin-Ping Lee, Ming-Shih Tsai, Ting-Chen Hu et al. · Electrochemical and Solid-State Letters · 2001 · 13 citations

Natural Sciences, Materials Engineering, Materials Science +17