Stresses and deformation processes in thin films on substrates

TLDR

Stresses that develop in thin films on substrates can compromise the reliability of thin‑film electronic devices. To improve mechanical reliability, the study seeks to understand the origins of these stresses and the deformation processes that control them. The review surveys stress‑measurement techniques, mechanical‑property studies, stress‑origin models, and the influence of microstructure and substrate constraint on thin‑film deformation.

Abstract

Abstract The stresses that develop in thin films on substrates can be detrimental to the reliability of thin film electronic devices. In order to design these devices for improved mechanical reliability, an understanding of the origin of these stresses and the controlling deformation processes in thin films is needed. This review begins with a discussion of the basic techniques used for measuring stresses in thin films and for studying the mechanical properties of thin films. The proposed models for the origin of stresses in thin films are then reviewed. Finally, the effects of microstructure and substrate constraint on thin film deformation processes are discussed.