A modified button-shear method for measuring fracture toughness of polymer-metal interfaces in IC packages

Biaxial Loading Experiments for Determining Interfacial Fracture Toughness

Kenneth M. Liechti, Young Suck Chai · Journal of Applied Mechanics · 1991 · 133 citations

Engineering, Materials Engineering, Materials Science +16

Bimaterial interfacial crack growth as a function of mode-mixity

Sheng Liu, Yuhai Mei, T. Y. Wu · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1995 · 105 citations

Engineering, Materials Engineering, Materials Science +17

Predicting delamination in plastic IC packages and determining suitable mold compound properties

A.A.O. Tay, G.L. Tan, T.B. Lim · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1994 · 78 citations

Natural Sciences, Materials Engineering, Materials Science +13

Influence of temperature, humidity, and defect location on delamination in plastic IC packages

A.A.O. Tay, T.Y. Lin · IEEE Transactions on Components and Packaging Technologies · 1999 · 60 citations

Engineering, Materials Engineering, Materials Science +17

A New Method for Measuring Adhesion Strength of IC Molding Compounds

A. Nishimura, Isao Hirose, Naotaka Tanaka · Journal of Electronic Packaging · 1992 · 42 citations

Natural Sciences, Materials Engineering, Materials Science +17