A global wiring paradigm for deep submicron design

Abstract

Global interconnect is commonly regarded as a key potential bottleneck to the advancing performance of high-speed integrated circuits. Our previous work has suggested that local interconnect effects can be managed through a deep submicron design hierarchy that uses 50000 to 100000 gate modules as primitive building blocks. The primary goal of this paper is to examine global interconnect effects, within such a design hierarchy, to determine if there are any significant roadblocks which will prevent National Technology Roadmap for Semiconductors (NTRS) performance expectations from being met. Specifically, the issues of global resistance-capacitance delay, signal time-of-flight, inductance, clock and power distribution, and noise are studied. Results indicate that, while global clock frequencies will necessarily he lower than local clock speeds, NTRS expectations should be attainable to the 50 nm technology generation. Achieving these high clock speeds (10 GHz local clock) will be aided by the use of a newly proposed routing hierarchy which limits interconnect effects at each level of a design (local, isochronous, and global).