Interconnect Modeling

Interconnect Modeling is a computational and mathematical framework that characterizes the electrical behavior of interconnecting structures in high-speed circuits to predict signal integrity performance through accurate representation of parasitic effects, transmission line properties, and frequency-dependent losses.

1.7K

Publications

76.9K

Citations

3.5K

Authors

669

Institutions

Publications per year

2017–2026

128

Authors

3.5K

  1. MN
    M. Nakhla

    Carleton University, Canada

    49 publications · 3.2K citations

    27

    h-index

  2. JW
    Jacob White

    Massachusetts Institute of Technology, United States

    32 publications · 2K citations

    22

    h-index

  3. AC
    A.C. Cangellaris

    University of Illinois Urbana-Champaign, United States

    30 publications · 1.4K citations

    20

    h-index

  4. JM
    J.D. Meindl

    Georgia Institute of Technology, United States

    25 publications · 2.3K citations

    20

    h-index

  5. BK
    Brajesh Kumar Kaushik

    Indian Institute of Technology Roorkee, India

    21 publications · 824 citations

    18

    h-index

1–5 of 3.5K

Venues

  1. 41

    h-index

  2. 39

    h-index

  3. IEEE Transactions on Electron Devices

    59 publications · 6.4K citations

    36

    h-index

  4. IEEE Transactions on Advanced Packaging

    69 publications · 3.6K citations

    34

    h-index

  5. 31

    h-index

1–5