Concepedia

Eugene J. Rymaszewski

EJ

Statistics

Publications

20

Citations

997

H-Index

15

Active since

1981

Affiliations

Rensselaer Polytechnic Institute(Current)

CSIR National Physical Laboratory of India

University at Albany, State University of New York

Eugene J. Rymaszewski is an author at Rensselaer Polytechnic Institute specializing in engineering, thin films, and applied physics.

Top concepts

EngineeringThin FilmsMaterial ScienceApplied PhysicsElectrical EngineeringMicroelectronicsMaterials EngineeringSurface ScienceElectronic PackagingElectrical Insulation

Publications per year

1981–2006

20

Publications

20

Microelectronics Packaging Handbook

Rao Tummala, Eugene J. Rymaszewski, Y. C. Lee · Journal of Electronic Packaging · 1989 · 535 citations

Advanced Packaging, Electrical Engineering, Chip-scale Package +6

Embedded thin film capacitors-theoretical limits

P.K. Jain, Eugene J. Rymaszewski · IEEE Transactions on Advanced Packaging · 2002 · 62 citations

Materials Science, Materials Engineering, Electrical Engineering +13

Reactive sputtering deposition of low temperature tantalum suboxide thin films

Xiaohan Wu, Ping Wu, Toh‐Ming Lu et al. · Applied Physics Letters · 1993 · 47 citations

Materials Science, Materials Engineering, Electrical Engineering +12

X-ray photoelectron spectroscopy study of Al/Ta2O5 and Ta2O5/Al buried interfaces

K. Chen, G.‐R. Yang, Matthew Nielsen et al. · Applied Physics Letters · 1997 · 36 citations

Materials Science, Aluminium Nitride, Surface Characterization +13

Integrated Flip-Chip Flex-Circuit Packaging for Power Electronics Applications

Ying Xiao, R. Natarajan, Eugene J. Rymaszewski et al. · IEEE Transactions on Power Electronics · 2004 · 34 citations

Electrical Engineering, Flip-chip Flex-circuit Packaging, Packaging Platform +12

1–5 of 20