IEEE Transactions on Plasma Science · 2004 · 24 citations · 4 references
EngineeringPlasma SciencePlasma PhysicsPlasma ElectronicsPulsed PlasmaPlasma ConfinementInstrumentationPlasma DopingPlasma DiagnosticsElectrical EngineeringPhysicsPulsed Plasma DopingMicroelectronicsNatural SciencesSpectroscopyApplied PhysicsDominant Ion SpeciesGas Discharge PlasmaPlasma ApplicationOptoelectronics
As semiconductor devices continue to shrink in size, demands for the formation of ultra-shallow junctions (USJ) are increasing. Pulsed plasma doping (P/sup 2/LAD) has emerged as a scaleable and cost effective solution to dopant delivery, since it is capable of high dose rates at ultra-low energies (0.02-20 kV). In P/sup 2/LAD, a pulsed plasma is generated adjacent to the silicon wafer using pulsed biases. Typical pulse widths range between 5 and 50 /spl mu/s, and pulse repetition rates are between 100 and 10000 Hz. Time-resolved Langmuir probe measurements showed that cold plasma is present during the afterglow period, which may play an important role in process control. Probe measurements also showed the presence of primary electron and electron beams during the initial pulse-on stage in both Ar and BF/sub 3/ plasmas. Ion mass and energy analysis indicated that BF/sub 2//sup +/ is the dominant ion species in the BF/sub 3/ plasmas, with BF/sup +/ as the second-most abundant ion species.
4
Characteristics of a plasma doping system for semiconductor device fabrication
Tt Sheng, Susan B. Felch, C. B. Cooper · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 1994 · 51 citations
Semiconductors, Semiconductor Devices, Electrical Engineering +13
Plasma doping system for 200 and 300 mm wafers
R.B. Liebert, S.R. Walther, Susan B. Felch et al. · 2000 International Conference on Ion Implantation Technology Proceedings. Ion Implantation Technology - 2000 (Cat. No.00EX432) · 2003 · 16 citations
Materials Engineering, Electrical Engineering, Plasma Ignition +12