IEEE Transactions on Nuclear Science · 2004 · 49 citations · 16 references
EngineeringElectrical EngineeringMicroelectronicsMicrowave EngineeringSemiconductor DevicesHigh-dose Radiation EffectsHigh-frequency Semiconductor DevicesIii-v SemiconductorsIntegrated Circuit DesignRadiation HardeningRadio-frequency Integrated CircuitsBicmos TechnologyBreakdown VoltageDevice Scaling EffectsHeterojunction Bipolar TransistorsHigh-dose ToleranceRadiation EffectsRadiation-tolerant Semiconductor DevicesTotal Dose
We report, for the first time, the impact of proton irradiation on fourth-generation SiGe heterojunction bipolar transistors (HBTs) having a record peak unity gain cutoff frequency of 350 GHz. The implications of aggressive vertical scaling on the observed proton tolerance is investigated through comparisons of the pre-and post-radiation ac and dc figures-of-merit to observed results from prior SiGe HBT technology nodes irradiated under identical conditions. In addition, transistors of varying breakdown voltage are used to probe the differences in proton tolerance as a function of collector doping. Our findings indicate that SiGe HBTs continue to exhibit impressive total dose tolerance, even at unprecedented levels of vertical profile scaling and frequency response. Negligible total dose degradation in /spl beta/ (0.3%), f/sub T/ and f/sub max/(6%) are observed in the circuit bias regime, suggesting that SiGe HBT BiCMOS technology is potentially a formidable contender for high-performance space-borne applications.
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SiGe HBTs with cut-off frequency of 350 GHz
Jae-Sung Rieh, B. Jagannathan, H. Chen et al. · 2003 · 201 citations