Fabrication and characterization of folded SU-8 suspensions for MEMS applications

The tension of metallic films deposited by electrolysis

G. Stoney · Proceedings of the Royal Society of London Series A Containing Papers of a Mathematical and Physical Character · 1909 · 4.8K citations · Full text

Natural Sciences, Chemistry, Materials Science +11

SU-8: a low-cost negative resist for MEMS

H. Lorenz, M. Despont, N. Fahrni et al. · Journal of Micromechanics and Microengineering · 1997 · 972 citations · Full text

Engineering, Materials Engineering, Materials Science +11

M-TEST: A test chip for MEMS material property measurement using electrostatically actuated test structures

P.M. Osterberg, S.D. Senturia · Journal of Microelectromechanical Systems · 1997 · 764 citations

Engineering, Electrical Engineering, Materials Science +17

Adhesion and stiction: Mechanisms, measurement techniques, and methods for reduction

Bharat Bhushan · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2003 · 484 citations

Engineering, Materials Science, Mechanical Engineering +16

Low-temperature full wafer adhesive bonding

Frank Niklaus, Peter Enoksson, Edvard Kälvesten et al. · Journal of Micromechanics and Microengineering · 2001 · 240 citations

Natural Sciences, Materials Engineering, Materials Science +16