Adhesion and stiction: Mechanisms, measurement techniques, and methods for reduction

Bharat Bhushan

Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2003 · 484 citations · 68 references

Concepts

Abstract

Solid–solid adhesion occurs at contacting asperities in two contacting solids. A thin liquid film with a small contact angle, present at the interface, can result in the so-called liquid-mediated adhesion. This may result in high adhesion during normal pull and high static friction during sliding, both commonly referred to as “stiction.” The problem of high stiction is especially important in an interface involving two very smooth surfaces under lightly loaded conditions. This article provides a critical and comprehensive review of mechanisms of adhesion and stiction, various measurement techniques, and methods used to reduce stiction in magnetic storage devices and micro/nanoelectromechanical systems.

References

68