TiN diffusion barriers for copper metallization

Diffusion barriers in thin films

M.−A. Nicolet · Thin Solid Films · 1978 · 681 citations

Materials Science, Engineering, Diffusion Resistance +5

Oxidation kinetics of TiN thin films

M. Wittmer, J. R. Noser, H. Melchior · Journal of Applied Physics · 1981 · 283 citations

Materials Science, Materials Engineering, Semiconductors +14

Copper metallization for ULSL and beyond

S. P. Murarka, Steven W. Hymes · Critical reviews in solid state and materials sciences/CRC critical reviews in solid state and materials sciences · 1995 · 259 citations

Reactively sputtered TiN as a diffusion barrier between Cu and Si

Shiqing Wang, Ivo J. Raaijmakers, Brad J. Burrow et al. · Journal of Applied Physics · 1990 · 244 citations

Engineering, Sputtered Tin, Thin Film Process Technology +19

Formation, oxidation, electronic, and electrical properties of copper silicides

A. Cros, M. O. Aboelfotoh, K. N. Tu · Journal of Applied Physics · 1990 · 203 citations

Materials Engineering, Semiconductors, Materials Science +15