IEEE Transactions on Electron Devices · 2003 · 57 citations · 17 references
Electrical EngineeringEngineeringRf SemiconductorNanoelectronicsBias Temperature InstabilitySurface ScienceApplied PhysicsUltrathin GateCutoff FrequencySemiconductor Device FabricationHigh Cutoff FrequencyMicroelectronicsSilicon On InsulatorSemiconductor Device
The dc and RF analog characteristics of ultrathin gate oxide CMOS on [110] surface-oriented Si substrates were investigated for the first time. The transconductance of p-MOSFETs on [110] substrates is 1.9 times greater than that on [100] substrates even in gate oxides in the direct-tunneling regime. An extremely high cutoff frequency of 110 GHz was obtained in 0.11 /spl mu/m gate length p-MOSFETs with 1.5 nm gate oxides. This is the highest value ever obtained for p-channel Si MOSFETs at room temperature. Further, it was demonstrated that more than 100 GHz of cutoff frequency is realized both for n- and p-MOSFETs. Thus, using [110] substrates results in a better balance for n- and p-MOS performances. The SiO/sub 2/ film and SiO/sub 2//Si interface qualities on [110] substrates were also investigated. In this experiment, it was found that direct-tunneling gate leakage current and initial 1/f noise of MOSFETs on [110] substrates are larger than those on [100] substrates. The reliability regarding Negative Bias Temperature Instability (NBTI) for p-MOSFETs on [110] substrates was also inferior to that for [100] MOSFETs. However, with a high-k insulator or improvement of the SiO/sub 2/ film quality, high mobility of p-MOSFETs on [110] substrates will have a potential not only for digital applications but also for new RF analog circuits under low supply voltage.
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1.5 nm direct-tunneling gate oxide Si MOSFET's
H. Sasaki, Mizuki Ono, T. Yoshitomi et al. · IEEE Transactions on Electron Devices · 1996 · 345 citations
H.S. Momose, Shigenari Nakamura, T. Ohguro et al. · IEEE Transactions on Electron Devices · 1998 · 106 citations