EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsSemiconductor DevicesSemiconductor MaterialsHigh-frequency Semiconductor DevicesMicrowave PackagingMicrowave Semiconductor DevicesWide Band Gap SemiconductorsWide-bandgap Semiconductor DevicesWide-bandgap SemiconductorsGaas Microwave Integrated CircuitsGallium ArsenideMicrowave Module IntegrationPackaging For High-frequency DevicesRadio-frequency DevicesRadio-frequency PackagingSemiconductor TechnologyWide Bandgap Semiconductor Applications
This paper will discuss pertinent issues and trends in X-band transmit/receive (T/R) modules. The performance of gallium arsenide (GaAs) T/R module components and wide bandgap semiconductors will be presented along with future challenges. T/R module cost will also be addressed with an emphasis on semiconductor cost factors and issues. Finally, a brief discussion of packaging and assembly issues will be provided.
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Recent Progress in SiC Microwave MESFETs
Scott T. Allen, S.T. Sheppard, W.L. Pribble et al. · MRS Proceedings · 1999 · 23 citations
Microwave flip chip and BGA technology
J.M. Bedinger · 2002 · 12 citations