Microwave Module Integration
Microwave Module Integration is a microwave packaging methodology that consolidates active and passive microwave components into a unified functional unit through optimized interconnects, material compatibility, and electromagnetic isolation to enhance performance, reliability, and miniaturization in microwave systems.
103
Publications
2.9K
Citations
434
Authors
126
Institutions
Publications per year
2017–2026
19
Parents
103
1–5 of 103
434
6
h-index
4
h-index
4
h-index
4
h-index
3
h-index
1–5 of 434
126
Institute for Mobile and Satellite Communication Technology
Kamp-Lintfort, Germany
5 h-index
17 publications
291 citations
Technische Universität Braunschweig
Braunschweig, Germany
4 h-index
10 publications
276 citations
Lockheed Martin (United States)
Bethesda, United States
3 h-index
10 publications
156 citations

National Yang Ming Chiao Tung University
Hsinchu, Taiwan
3 h-index
10 publications
317 citations
IMEC
Leuven, Belgium
3 h-index
8 publications
148 citations
L-3 Communications (United States)
New York, United States
3 h-index
25 publications
638 citations
Georgia Institute of Technology
Atlanta, United States
3 h-index
21 publications
992 citations

City University of Hong Kong
Hong Kong, Hong Kong
2 h-index
4 publications
188 citations
1–8 of 126
14 publications · 788 citations
14
h-index
3 publications · 86 citations
3
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2 publications · 160 citations
2
h-index
2 publications · 30 citations
2
h-index
Conference · 2 publications · 29 citations
2
h-index
1–5