Microwave Module Integration

Microwave Module Integration is a microwave packaging methodology that consolidates active and passive microwave components into a unified functional unit through optimized interconnects, material compatibility, and electromagnetic isolation to enhance performance, reliability, and miniaturization in microwave systems.

103

Publications

2.9K

Citations

434

Authors

126

Institutions

Publications per year

2017–2026

19

Authors

434

  1. PH
    P. Heide

    Siemens (Germany), Germany

    6 publications · 159 citations

    6

    h-index

  2. AL
    A. L. Chernyakov

    Kurchatov Institute, Russia

    4 publications · 120 citations

    4

    h-index

  3. JH
    Johann Heyen

    Technische Universität Braunschweig, Germany

    4 publications · 133 citations

    4

    h-index

  4. AF
    Arne F. Jacob

    Hamburg University of Technology, Germany

    4 publications · 127 citations

    4

    h-index

  5. RD
    Ramon Duggal

    L-3 Communications (United States), United States

    3 publications · 66 citations

    3

    h-index

1–5 of 434

Venues

  1. 14

    h-index

  2. 3

    h-index

  3. Proceedings of the IEEE

    2 publications · 160 citations

    2

    h-index

  4. 2

    h-index

  5. 2011 IEEE MTT-S International Microwave Symposium

    Conference · 2 publications · 29 citations

    2

    h-index

1–5