Japanese Journal of Applied Physics · 1998 · 12 citations · 8 references
EngineeringMaterials ScienceMechanical EngineeringMicroelectromechanical SystemsMicrofabricationSemiconductor DevicesMems DesignMems FabricationMicrofabrication MaterialsMicromachiningSurface MicromachiningContact ResistanceContact Thermal ResistanceMicro ProbesMicromachining Of Silicon WafersPorous SiliconSilicon MicromachiningThermal ExpansionThermal Expansion Coefficient
We report on the fabrication of a new type of probe card that uses a porous silicon micromachining technique. Curled cantilever tips are fabricated using surface tension and the difference in the thermal expansion coefficient between the films. The contact resistance of cantilever tips with an aluminum pad is basically below 1 Ω and there is no change of contact resistance after 700,000 contacts.
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Porous silicon formation mechanisms
R. L. Smith, Scott D. Collins · Journal of Applied Physics · 1992 · 1.2K citations
C.J.M. Eijkel, J. Branebjerg, F.C.M. van de Pol · IEEE Electron Device Letters · 1990 · 43 citations · Full text