Shinichiro Asai - Concepedia

Author

Shinichiro Asai

Also Known As

Asai, S., Asai, Shinichiro, Hao, Yiquing, Hiraishi, M, S Asai, S. Asai, SHIN'ICHIRO Asai, SHIN-ICHIRO ASAI, Shin'ichiro Asai, Shin-ichiro Asai

Publications

757

Citations

H-Index

Concepts

All Affiliations

The University of Tokyo Denka (Japan)High Energy Accelerator Research Organization Shanghai Jiao Tong University Japan Proton Accelerator Research Complex

About

Shinichiro Asai is an author at The University of Tokyo specializing in engineering, materials science, and applied physics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	8	8	256
2	Applied Physics	4	4	144
3	Natural Sciences	2	2	98
4	Chemistry	2	2	29
5	Electrical Engineering	2	2	46

Shinichiro Asai

Publications

542

Citations

H-Index

Page 1

	Year	Citations
Field-induced quantum spin disordered state in spin-1/2 honeycomb magnet Na2Co2TeO6 Gaoting Lin, Jaehong Jeong, Chaebin Kim, Nature Communications	2021	138
Antiferromagnetic Kitaev interaction in<i>J</i> <sub>eff</sub> <b>=</b> 1/2 cobalt honeycomb materials Na<sub>3</sub>Co<sub>2</sub>SbO<sub>6</sub> and Na<sub>2</sub>Co<sub>2</sub>TeO<sub>6</sub> Chaebin Kim, Jaehong Jeong, Gaoting Lin, Journal of Physics Condensed Matter	2021	106
Chiral Split Magnon in Altermagnetic MnTe Zheyuan Liu, Makoto Ozeki, Shinichiro Asai, Physical Review Letters Magnetic PropertiesEngineeringSpin TexturesMagnetic ResonanceMagnetic Textures	2024	79
Development of an anisotropic conductive adhesive film (ACAF) from epoxy resins Shinichiro Asai, Ueki Saruta, Masayuki Tobita, Journal of Applied Polymer Science Materials ScienceEngineeringEpoxy ResinsPolymer TechnologyAdhesive Material	1995	69
Fabrication of an insulated metal substrate (IMS), having an insulating layer with a high dielectric constant Shinichiro Asai, Masahiro Funaki, Hezekiah B. Sawa, IEEE Transactions on Components Hybrids and Manufacturing Technology EngineeringInterconnect (Integrated Circuits)Electromagnetic CompatibilityMicro-electromechanical SystemAdvanced Packaging (Semiconductors)	1993	24
Probe card with probe pins grown by the vapor-liquid-solid (VLS) method Shinichiro Asai, Koichi Kato, Nobuya Nakazaki, IEEE Transactions on Components Packaging and Manufacturing Technology Part A EngineeringMicroscopyInstrumentation EngineeringSilicon On InsulatorWafer Scale Processing	1996	22
Soldering deterioration of epoxy‐molded IC packages after moisture absorption Shinichiro Asai, Uki Saruta, Masanori Tobita Journal of Applied Polymer Science Materials ScienceEngineeringAdvanced Packaging (Semiconductors)Mechanical PropertiesChip On Board	1994	20
Novel Charge Ordering in the Trimer Iridium Oxide BaIrO3 Ichiro Terasaki, Shun Ito, Taichi Igarashi, Crystals Materials ScienceInorganic ChemistryTransition Metal ChalcogenidesEngineeringPhysics	2016	19
Low temperature magnetic properties of Nd<sub>2</sub>Ru<sub>2</sub>O<sub>7</sub> Szu-Tu Ku, Dinesh Kumar, M. R. Lees, Journal of Physics Condensed Matter	2018	15
A layered wide-gap oxyhalide semiconductor with an infinite ZnO<sub>2</sub> square planar sheet: Sr<sub>2</sub>ZnO<sub>2</sub>Cl<sub>2</sub> Yu Su, Yoshihiro Tsujimoto, Akira Miura, Chemical Communications	2017	14

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