M. Beiley

A micromachined array probe card-characterization

M. Beiley, J. Leung, S.S. Wong · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1995 · 48 citations

Engineering, Electrical Engineering, Materials Science +17

A micromachined array probe card-fabrication process

M. Beiley, J. Leung, S.S. Wong · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1995 · 42 citations

Engineering, Electrical Engineering, Manufacturing Engineering +16

<title>Test structures for characterization and comparative analysis of CMOS image sensors</title>

David Yang, Hao Min, Boyd Fowler et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 1996 · 15 citations

Engineering, Electrical Engineering, Microelectronics +16

Copper Interconnection with Tungsten Cladding for UlSI

J.S.H. Cho, H-K. Kang, M. Beiley et al. · 1991 · 11 citations

Engineering, Electrical Engineering, Materials Engineering +17

Array probe card

M. Beiley, F. Ichishita, C.T. Nguyen et al. · 2003 · 10 citations

Engineering, Electrical Engineering, Electronic Materials +16