IEEE Transactions on Device and Materials Reliability · 2001 · 88 citations · 18 references
Hc LifetimeElectrical EngineeringLucky Electron ModelEngineeringRf SemiconductorPhysicsE-e ScatteringNanoelectronicsElectronic EngineeringHc DamageApplied PhysicsBias Temperature InstabilityMicroelectronicsSemiconductor DeviceDeep-submicron Nmosfets
It has been reported in the literature that in deep-submicron nMOSFETs, the worst channel hot carrier (CHC) degradation is not near the peak substrate current (as predicted by the lucky electron model), but at the V/sub GS/=V/sub DS/ bias condition. We propose a new CHC model based on an electron-electron scattering-induced hot carrier (HC) mechanism, that explains the worsening of the HC damage at high VGs and agrees well with the HC lifetime measured over the moderate to high gate voltage range and a wide L/sub EFF/ range. The predicted quadratic source current dependence of HC lifetime at mid V/sub GS//V/sub DS/, evolving into a cubic dependence at high V/sub GS//V/sub DS/, matches well the observed behavior.
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Hot-electron-induced MOSFET degradation—Model, monitor, and improvement
Chenming Hu, Simon Tam, Fu-Chieh Hsu et al. · IEEE Transactions on Electron Devices · 1985 · 1.1K citations