Electromigration-induced Bi-rich whisker growth in Cu/Sn–58Bi/Cu solder joints

Whisker and Hillock formation on Sn, Sn–Cu and Sn–Pb electrodeposits

W. J. Boettinger, C. E. Johnson, L.A. Bendersky et al. · Acta Materialia · 2005 · 322 citations

Natural Sciences, Materials Engineering, Materials Science +15

Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffraction

Woon‐Seop Choi, T. Y. Lee, K. N. Tu et al. · Acta Materialia · 2003 · 167 citations

Natural Sciences, Materials Engineering, Materials Science +14

In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing

Yuan Lin, Yu Hu, Cheng‐Hsien Tsai et al. · Acta Materialia · 2005 · 147 citations

Engineering, Materials Engineering, Materials Science +15

Mechanism of electromigration-induced failure in the 97Pb–3Sn and 37Pb–63Sn composite solder joints

Jae-Woong Nah, Kyung W. Paik, Jong-ook Suh et al. · Journal of Applied Physics · 2003 · 140 citations

Natural Sciences, Materials Engineering, Materials Science +15

An integrated theory of whisker formation: the physical metallurgy of whisker formation and the role of internal stresses

G.T. Galyon, Larry Palmer · IEEE Transactions on Electronics Packaging Manufacturing · 2005 · 136 citations

Natural Sciences, Materials Engineering, Materials Science +17