Concepedia

Hongwen He

HH

Statistics

Publications

10

Citations

195

H-Index

10

Active since

2008

Affiliations

Beijing University of Technology(Current)

Tsinghua University

Michigan State University

Institute of Microelectronics

Chinese Academy of Sciences

Hongwen He is an author at Beijing University of Technology specializing in materials science, materials engineering, and electronic materials.

Publications per year

2008–2014

10

Publications

10

Electromigration behaviors in Sb particle-reinforced composite eutectic SnAgCu solder joints

Fu Guo, Guangchen Xu, Hongwen He · Journal of Materials Science · 2009 · 31 citations

, , +6

Effect of small amount of rare earth addition on electromigration in eutectic SnBi solder reaction couple

Hongwen He, Guangchen Xu, Fu Guo · Journal of Materials Science · 2009 · 29 citations

, , +8

Effect of thermal annealing on TSV Cu protrusion and local stress

Xiangmeng Jing, Hongwen He, Liang Ji et al. · 2014 · 24 citations

, , +17

Bi Layer Formation at the Anode Interface in Cu/Sn-58Bi/Cu Solder Joints with High Current Density

Hongwen He, Haiyan Zhao, Fu Guo et al. · Journal of Material Science and Technology · 2012 · 23 citations

, , +17

Electromigration-induced Bi-rich whisker growth in Cu/Sn–58Bi/Cu solder joints

Hongwen He, Guangchen Xu, Fu Guo · Journal of Materials Science · 2009 · 19 citations

, , +14

1–5 of 10