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On the Fracture Toughness of Advanced Materials

Maximilien E. Launey, Robert O. Ritchie · Advanced Materials · 2009 · 933 citations

Engineering, Materials Engineering, Materials Science +13

Scanning X-ray microdiffraction with submicrometer white beam for strain/stress and orientation mapping in thin films

Nobumichi Tamura, Alastair A. MacDowell, Ralph Spolenak et al. · Journal of Synchrotron Radiation · 2003 · 268 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Effect of thermal aging on board level drop reliability for Pb-free BGA packages

Tz-Cheng Chiu, Kejun Zeng, R.J. Stierman et al. · 2004 · 248 citations

Engineering, Materials Engineering, Materials Science +17

Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits

Arief Suriadi Budiman, Hyun-Pyo Shin, Bum‐Joon Kim et al. · Microelectronics Reliability · 2011 · 143 citations

Engineering, Electrical Engineering, Materials Science +14

Quality control of as-cut multicrystalline silicon wafers using photoluminescence imaging for solar cell production

Jonas Haunschild, Markus Glatthaar, Matthias Demant et al. · Solar Energy Materials and Solar Cells · 2010 · 91 citations

Engineering, Materials Engineering, Materials Science +16