Dual etch processes of via and metal paste filling for through silicon via process

Characterization of a Time Multiplexed Inductively Coupled Plasma Etcher

Arturo A. Ayón, Rebecca A. Braff, C. C. Lin et al. · Journal of The Electrochemical Society · 1999 · 411 citations

Engineering, Materials Engineering, Materials Science +13

3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections

Katsuyuki Sakuma, Paul Andry, Cornelia Tsang et al. · IBM Journal of Research and Development · 2008 · 163 citations

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An advanced reactive ion etching process for very high aspect-ratio sub-micron wide trenches in silicon

Reza Abdolvand, Farrokh Ayazi · Sensors and Actuators A Physical · 2008 · 145 citations

Engineering, Materials Engineering, Materials Science +14

Mechanisms of silicon etching in fluorine- and chlorine-containing plasmas

Daniel Flamm · Pure and Applied Chemistry · 1990 · 116 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +10

Mechanisms of laser drilling of metal plates underwater

Jian Lü, Runchu Xu, X. Chen et al. · Journal of Applied Physics · 2004 · 77 citations

Engineering, Ocean Engineering, Drilling +14