Kun-Sik Park

Dual etch processes of via and metal paste filling for through silicon via process

Yong-Hyun Ham, Dong‐Pyo Kim, Kun-Sik Park et al. · Thin Solid Films · 2011 · 25 citations

Materials Science, Materials Engineering, Metal Paste Filling +11

Fabrication of low-cost submicron patterned polymeric replica mold with high elastic modulus over a large area

Joo Yeon Kim, Kun-Sik Park, Zin‐Sig Kim et al. · Soft Matter · 2011 · 20 citations

Engineering, Mechanical Engineering, Nanostructured Polymer +23

Modeling oxide etching in a magnetically enhanced reactive ion plasma using neural networks

Byungwhan Kim, Kwang‐Ho Kwon, Sung‐Ku Kwon et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2002 · 18 citations

Chemical Engineering, Engineering, Plasma Simulation +12

Subthreshold characteristics of pentacene field-effect transistors influenced by grain boundaries

Jaehoon Park, Yesul Jeong, Kun-Sik Park et al. · Journal of Applied Physics · 2012 · 13 citations · Full text

Materials Science, Materials Engineering, Electrical Engineering +13