Characterization of Solder Joint Reliability Using Cyclic Mechanical Fatigue Testing

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports · 2002 · 1.4K citations

Engineering, Materials Engineering, Materials Science +15

Solder joint fatigue models: review and applicability to chip scale packages

W.W Lee, Luu Nguyen, Guna S Selvaduray · Microelectronics Reliability · 2000 · 507 citations

Natural Sciences, Materials Engineering, Materials Science +11

Electronics Without Lead

Yi Li, Kyoung‐sik Moon, C.P. Wong · Science · 2005 · 496 citations

Engineering, Electrical Engineering, Materials Science +14

Lead-Free Solder Interconnect Reliability

Soldering and Surface Mount Technology · 2005 · 199 citations

Engineering, Electrical Engineering, Materials Science +14

Thermal cycling analysis of flip-chip solder joint reliability

J.H.L. Pang, Desmond Y. R. Chong, T.H. Low · IEEE Transactions on Components and Packaging Technologies · 2001 · 168 citations

Engineering, Materials Engineering, Materials Science +17