Effects of bonding pressure on the thermo-mechanical reliability of ACF interconnection

Recent advances on anisotropic conductive adhesives (ACAs) for flat panel displays and semiconductor packaging applications

Myung Jin Yim, Kyung W. Paik · International Journal of Adhesion and Adhesives · 2005 · 192 citations

Materials Science, Electrical Engineering, Semiconductor Packaging Applications +10

Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature

Y.C. Chan, D.Y Luk · Microelectronics Reliability · 2002 · 117 citations

Materials Science, Different Bonding Temperature, Flip-chip-on-flex Packages +10

Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure

Y.C. Chan, D.Y Luk · Microelectronics Reliability · 2002 · 113 citations

Materials Science, Flip-chip-on-flex Packages, Chip-scale Package +11

Fundamental understanding of ACF conduction establishment with emphasis on the thermal and mechanical analysis

Woon‐Seong Kwon, Kyung‐Wook Paik · International Journal of Adhesion and Adhesives · 2003 · 63 citations

Materials Science, Engineering, Mechanical Analysis +11

Flow characterization and thermo-mechanical response of anisotropic conductive films

R. Dudek, S. Meinel, Andreas Schubert et al. · IEEE Transactions on Components and Packaging Technologies · 1999 · 48 citations

Bonding Process, Engineering, Mechanical Engineering +19