Won-Chul Moon

AFM fabrication of oxide patterns and immobilization of biomolecules on Si surface

Tatsuo Yoshinobu, Jun Suzuki, H. Kurooka et al. · Electrochimica Acta · 2003 · 53 citations

Materials Science, Afm Fabrication, Engineering +9

Interfacial reaction of ENIG/Sn-Ag-Cu/ENIG sandwich solder joint during isothermal aging

Jeong‐Won Yoon, Won-Chul Moon, Seung‐Boo Jung · Microelectronic Engineering · 2006 · 39 citations

Materials Engineering, Materials Science, Interfacial Reaction +7

Interfacial reactions and joint strength of Sn–37Pb and Sn–3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 °C

Jeong‐Won Yoon, Jun Hyung Lim, Hoo-Jeong Lee et al. · Journal of materials research/Pratt's guide to venture capital sources · 2006 · 29 citations

Materials Engineering, Materials Science, Interfacial Reactions +8

Effects of bonding pressure on the thermo-mechanical reliability of ACF interconnection

Jong‐Woong Kim, Won-Chul Moon, Seung‐Boo Jung · Microelectronic Engineering · 2006 · 27 citations

Thermo-mechanical Reliability, Electrical Engineering, Engineering +10

Surface finishes of rolled copper foil for flexible printed circuit board

Chang‐Yong Lee, Won-Chul Moon, Seung‐Boo Jung · Materials Science and Engineering A · 2007 · 26 citations

Materials Science, Copper Foil, Engineering +9