IEEE Transactions on Electron Devices · 2014 · 43 citations · 15 references
EngineeringElectrical EngineeringPhysicsCondensed Matter PhysicsElectronic MaterialsSemiconductor DevicesDevice ModelingElectron TransportElectronic Transport ModelingTwo-dimensional SemiconductorsWide Band Gap SemiconductorsBiasesElectron MobilityMetal-semiconductor InterfacesSubthreshold OperationTwo-dimensional Electron GasesTwo-dimensional Electron Systems
In this paper, the 2-D electron gas density <formula formulatype="inline" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex Notation="TeX">$({n}_{s})$</tex></formula> and Fermi level <formula formulatype="inline" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex Notation="TeX">$({E}_{f})$</tex></formula> analytical expressions as an explicit function of the terminal biases that covers the strong- and moderate-inversion and subthreshold regions and scalable with physical parameters are developed. It is validated by the comparison with the (exact) numerical solutions for different device parameters, in which the device operating region may encompass one or two lowest sub-bands ( <formula formulatype="inline" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex Notation="TeX">${E}_{0}$</tex></formula> and <formula formulatype="inline" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex Notation="TeX">${E}_{1}$</tex> </formula> ) in the triangular well. With the unified <formula formulatype="inline" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex Notation="TeX">${E}_{f}$</tex></formula> model, a surface-potential <formula formulatype="inline" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex Notation="TeX">$(\phi_{s})$</tex></formula> based drain-current <formula formulatype="inline" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex Notation="TeX">$({I}_{\rm ds})$</tex></formula> model for the metal–insulator–semiconductor (MIS) high electron-mobility transistor (HEMT) is developed. Nonlinear source/drain access region resistances ( <formula formulatype="inline" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex Notation="TeX">${R}_{s}$</tex></formula> and <formula formulatype="inline" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex Notation="TeX">${R}_{d}$</tex></formula> ) can also be modeled via a subcircuit, including an empirical <formula formulatype="inline" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex Notation="TeX">${R}_{s}$</tex></formula> model for capturing the current-collapse effect. The compact drain-current model is shown to match the experimental data of MIS HEMTs very well in both subthreshold and strong-inversion regions, with smooth and symmetric behaviors and including the (dc) self-heating effect. It also models the corresponding MIS diode <formula formulatype="inline" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex Notation="TeX">$C-V$</tex></formula> using the same set of physical and minimum fitting parameters.
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